Some 30 undergraduate students from the University of Washington and other partner universities from the United States and United Kingdom took part in this year’s STEM Summer Programme (TSSP), an interactive exploration of science, technology, engineering and mathematics.

Running from June 23 to July 18, the programme offered participants a comprehensive overview of the university’s academic offerings through a carefully curated blend of lectures, laboratory visits and cultural workshops that showcased both cutting-edge research and traditional Japanese heritage.

2025.08.05